Careers

■ Optical Packaging Design (CPO): Responsible for the optical design of Co-Packaged Optics (CPO) modules, including optical path planning, chip-to-fiber coupling solutions, and the selection and simulation of components such as lenses, collimators, and waveguides; optimize optical link loss, coupling efficiency, assembly tolerance, and reliability.

■ Mechanical Structure & Thermal Management Design: Complete structural design, assembly tolerance analysis, and stress assessment for optical modules, coupling components, and optoelectronic interfaces; participate in thermal path planning, material selection, and thermal simulation to ensure long-term reliable system operation.

■ Sample Verification & Problem Analysis: Responsible for prototype assembly & alignment, performance testing, and data analysis; perform root cause analysis and improvement for assembly deviation, optical loss, reliability failures, and other issues.

■ Cross-Team Collaboration: Work closely with the silicon photonics design, electronics design, process, test, and supply chain teams to drive product realization.

Job Requirements

Education Background

• Master's degree or above in Optical Engineering, Precision Instrumentation, Mechanical Engineering, Microelectronics, Electronic Packaging, or related fields.

Technical Competencies

• Familiar with optical design tools (e.g., Zemax / CodeV / Lumerical / FDTD), capable of optical path design, coupling simulation, and tolerance analysis

• Proficient in mechanical design software (e.g., SolidWorks / Creo), with structural design and precision assembly analysis capabilities

• Thermal simulation and thermal management design capability, familiar with COMSOL / Ansys Icepak / Flotherm and other tools, able to analyze internal thermal distribution, temperature drift effects, and thermal dissipation solutions within the package

• Familiar with structural stress and reliability simulation, proficient in Ansys Mechanical / Abaqus and other tools, with analysis experience in packaging material stress, deformation, curing stress, and thermal cycling reliability

• Understanding of advanced packaging technologies (CPO, optoelectronic co-packaging, 3D integration, precision alignment/bonding, etc.); hands-on project experience is preferred

• Basic understanding of silicon photonics platforms, optical devices (lasers, modulators, photodetectors, WDM multiplexers, etc.), and coupling methods is a plus

Experience Requirements

• Experience in optical packaging, optical modules, optical engines, silicon photonics coupling, TOSA/ROSA, or high-end advanced packaging projects

• Familiarity with precision optical alignment and active/passive coupling assembly processes is preferred

Soft Skills

• Good communication, teamwork, and project-driving abilities

• Self-motivated, able to independently drive tasks in a multi-team environment

Bonus Points

• Experience in CPO / OIO / HPC optical interconnect packaging

• Familiarity with laser die attach, flying-wire bonding, eutectic bonding, and fiber array packaging processes

• Experience in system-level optoelectronic co-design (e.g., electrical-optical co-design)

What We Offer

• Competitive compensation and benefits: five social insurances and housing fund, paid annual leave, and rental subsidy

• Cutting-edge high-speed optical interconnect and advanced packaging R&D opportunities

• Complete technical growth path and a multi-team collaboration platform