Beijing Lingxi Photonix Technology Co., Ltd

Technical Route

End-to-end technical capabilities have been established, with prototype products scheduled for release in 2026–2027.

Lingxi Photonix has chosen a silicon micro-ring-based light engine technology with an external light source.

Based on the team's accumulation and technical foundation in PIC and EIC directions, we will provide high bandwidth density, high signal quality, low power consumption, and high robustness optical interconnect solutions for Scale up and Scale out scenarios in the intelligent computing center through collaborative design and high-density sealing between PIC and EIC.

Jointly invested by
multiple well-known institutions

Beijing Shunxi Venture Capital Fund Management Co., Ltd.

Applications

Single-channel 500 Gb/s · 16×256 Gb/s wavelength division multiplexing;
Key technologies verified

AI Scale-out

Connect ten thousand card level AI clusters to build a data center level interconnection network with high bandwidth and low power consumption.

Interconnect: Switches, Network Interface Cards

Scenarios: Between racks, computing clusters

Protocols: InfiniBand, UEC

Requirements: Maintainability, flexible networking

AI Scale-up

Breaking through the upper limit of single rack computing power and creating high-density 'supercomputing nodes'.

Interconnect: Switch, XPU

Scenarios: Rack, Supernode

Protocols: NVLink, UALink, Huawei UB

Requirements: Bandwidth Density, Power Consumption, Latency

AI Scale-in

Breaking through the bottleneck of data transmission within the chip and unleashing the ultimate computing power of a single chip.

Interconnect: XPU、HBM

Scenarios: Internal Interconnects in Single-Board Card Packages

Protocols: UCIe、PCIe

Requirements: Channel Density, Ultra-Low Power Consumption, and Ultra-Low Latency

Why choose us

Micro-Ring Silicon optical Engine · Enabling High-Speed Optical Interconnects for AI Computing Clusters

Background of the Chinese Academy of Sciences

Originating from the Xi'an Institute of Optics and Precision Mechanics of the Chinese Academy of Sciences (XIOP, CAS)

Technical advantages

We have built a full chain technology capability covering optical chips, electrical chips, lasers, and advanced packaging

Autonomous and Controllable Supply Chain

Optical chips are based on silicon photonics processes, while electronic chips primarily consist of analog circuits; neither relies on advanced manufacturing processes below 7 nm.

Optical Interconnects
for AI Clusters

Technical Route

Jointly invested by
multiple well-known institutions